Beneath Heat 22 mm T&G Foiled Chipboard Over Joists UFH System - Underfloor Heating System
Verified by manufacturer 3 months ago
Underfloor heating (UFH) system with grooved T&G foiled P5 grade chipboard fixed to the top of joists, becoming a structural floor deck once a minimum of 6 mm ply is fixed on top.
Application
Underfloor heating (UFH) system for use over timber joists, in new builds and renovation.
Description
Underfloor heating (UFH) system with grooved T&G foiled P5 grade chipboard fixed to the top of joists, becoming a structural floor deck once a minimum of 6 mm ply is fixed on top.
Features and benefits:
- High thermal performance with foil-covered chipboard.
- Good heat retention (low thermal conductivity).
- Can be used on an acoustic system on separating floors.
- Separation layer of 6 mm ply is recommended before applying floor finish (engineered wood or laminate can sit directly on top of the chipboard).
- Note that insulation is required between the joists to current Building Regulations.
- Available in 150 and 200 mm pipe centres.
- Compatible with 16 mm-diameter PERT and MLCP pipes.
- Heating performance*:
- 150 mm pipe centres: 69 W/m².
- 200 mm pipe centres: 65 W/m².
*Heat output at a flow water temperature of 45°, based on a tog rating of 1 with a room temperature of 21°. Consult manufacturer's literature for full details.
General information
Color | Silver Guidance for specification option: Chipboard only. |
Finish | Foil Guidance for specification option: Chipboard only. |
Material | Chipboard Guidance for specification option: P5 grade. |
Shape | Rectangle |
Length | 1200 mm |
Width | 600 mm |
Height | 22 mm |
Warranty description | Two year Guidance for specification option: Electrical and mechanical products. 50 year Guidance for specification option: Pipes. Manufacturer guidanceConsult manufacturer for full details. |
Uniclass | |
CAWS | T90/475 Underfloor heating systems T90/475 Underfloor heating systems |
Specification data - Underfloor low-temperature hot water heating systems
System performance | Guidance for specification option: Insert requirements. |
Heat source | Low-temperature hot water heating system.Guidance for specification option: Specify details separately. |
Pumps | Beneath Heat underfloor heating pump pack.Beneath Heat single area pump pack.Manufacturer guidanceConsult manufacturer for details. |
Pipework | |
Distribution | Guidance for specification option: Insert requirements. |
Underfloor | 16 mm PERT pipes and fittings.16 mm MLCP pipes and fittings.Manufacturer guidanceInstallation tools available, including pipe decoilers, pipe cutters and pipe calibrators. |
Jointing materials | Guidance for specification option: Insert requirements. |
Insulation | Insulation panels, laid between joists.Guidance for specification option: Consult manufacturer's literature for installation details. Manufacturer guidanceConsult manufacturer for details. |
Pipe supports | 40 mm pipe staples at 150 mm centres with dry screed mix (3:1 sand/cement).60 mm pipe staples at 150 mm centres with dry screed mix (3:1 sand/cement).40 mm pipe staples at 200 mm centres with dry screed mix (3:1 sand/cement).60 mm pipe staples at 200 mm centres with dry screed mix (3:1 sand/cement).Manufacturer guidance
|
Valves | Guidance for specification option: Consult manufacturer for options and insert requirements. Options include manifolds, blend valves, heat pump valves and return elbows. |
Water treatment | Guidance for specification option: Consult manufacturer for options and insert requirements or omit. |
Accessories | 230 V Saswell dial thermostat.Guidance for specification option: Consult manufacturer for options and insert requirements. 230 V Saswell programable thermostat.230 V Saswell WiFi thermostat.Wireless Saswell programable thermostat.Wireless Saswell WiFi thermostat.Saswell WiFi gateway |
Controls | |
Controllers | Saswell 230 V two wire actuator.230 V wiring centre.230 V wireless wiring centre. |
Control valves | Saswell two-port motorised valve. |
Sensors | Not required.Saswell floor/ air sensor.Single area pump pack adaptors.Guidance for specification option: Not for use with single area pump pack. |
Floor components | Structural floor deck.Guidance for specification option: Insert details. Specify separately as required. |
Floor covering | Guidance for specification option: Insert details. Specify separately as required. |
Sustainability data
Contains Red List materials | No |
Country of material origin | United Kingdom |
Country of product manufacture | United Kingdom |
Recyclability | 0 |
Recycled contentAs defined in clause 7.8 of BS EN ISO 14021 | 0 % |
Literature
Beneath Plate 22 mm Foiled Chipboard Over Joists UFH System
Underfloor Heating Product and Technical Guide
Similar products from Beneath Heat
Beneath Heat 15 mm Slim Board Over Floor UFH System - Underfloor Heating System
Beneath Heat 20 mm Slim Board Over Floor UFH System - Underfloor Heating System
Beneath Heat Clip & Rail Screeded Floor UFH System - Traditional Underfloor Heating System
Beneath Heat Dry Screed Mix Between Joists UFH System - Underfloor Heating System
Beneath Heat Slim Fix Over Floor UFH System - Underfloor Heating System
Beneath Heat Spreader Plate Between Joists UFH System - Underfloor Heating System
Beneath Heat Staple Screeded Floor UFH System - Traditional Underfloor Heating System
Beneath Heat Tacker Panel Screeded Floor UFH System - Underfloor Heating System