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Compressible board substructure formwork - BIM objects

Find and specify compressible board substructure formwork from top manufacturers with NBS Source. Browse 5 free BIM objects and Revit families that are ready to use on your projects. Classification Pr_25_71_29_16.

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View manufacturers of Compressible board substructure formwork
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BOS
Sponsored
Cellcore HX B

Cellcore HX B

Verified 2 days ago

Cordek Ltd

Collapsible void former for use under reinforced concrete ground beams and pile caps. The product has a number of variables including panel width, depth and loading characteristics.
BOS
Sponsored
Cellcore HX S

Cellcore HX S

Verified 2 days ago

Cordek Ltd

Collapsible void former for use under reinforced concrete floor slabs. The product has a number of variables including panel depth and loading characteristics.
BOS
Sponsored
BEWI GHP - Ground Heave Protection

BEWI GHP - Ground Heave Protection

Verified 4 months ago

BEWI UK Insulation

A range of EPS cellular void formers used to limit the pressure exerted on in-situ reinforced concrete floors or piled ground beams by the expansion of clay soils, (clay heave), or ground recovery.
+3
BOS
Sponsored
ClayMaster - Compressible Fill Material

ClayMaster - Compressible Fill Material

Verified 4 months ago

BEWI UK Insulation

An EPS compressible fill material to reduce the pressure against foundations due to clay heave.
BOS
Sponsored
Cellcore HX Plus

Cellcore HX Plus

Verified 5 months ago

Cordek Ltd

Collapsible void former with integral insulation for use under reinforced concrete floor slabs. The product has a number of variables including panel depth, thermal and loading characteristics.

Showing 1-5 of 5