HEXATHERM® XCHiP - Thermal Chipboard Laminate Floorboard
Verified by manufacturer 6 months ago
Extruded polystyrene thermal insulation board bonded to a chipboard facing.
Application
Thermal insulation board, suitable for floors and walls.
Description
High performance extruded polystyrene with a facing board to produce a composite thermal board to suit a specific application.
Features and benefits:
- 100% recyclable.
- CFC and HCFC free.
- Closed cell structure.
- Code for Sustainable Homes Pol 1 compliant.
- Composite board.
- High compressive strength.
- High thermal performance.
- Wide range of thicknesses available: 20–160 mm.
- Zero ODP & Less than 5 GWP.
- Manufactured in accordance with BS EN 13374, and tested to BS EN 12267.
- Long term water absorption by immersion (% volume, to BS EN 12087): <0.7%.
Grade (to BS EN 826): CS250.
General information
Color | Grey Yellow |
Finish | Smooth |
Material | High density extruded polystyrene (XPS) Guidance for specification option: (XPS) with an 18/ 22 mm thick chipboard facing Chipboard |
Shape | Rectangle |
Length | 2400 mm |
Width | 600 mm |
Height | 38 mm 43 mm 48 mm 58 mm 68 mm |
Uniclass | |
CAWS | E20/200 Proprietary underslab insulation E20/30 Underslab insulation M10/290 Floating construction M10/40 Floating construction M11/220 Mastic asphalt floor underlay |
Specification data - Extruded polystyrene (XPS) boards
Compressive strength (minimum) at 10% compression | To BS EN 826, 300 kPa. |
Thermal conductivity (maximum) | To BS EN 12667, 0.033—0.034 W/mK. |
Thickness | 20 mm + 18/ 22 mm chipboard facing.25 mm + 18/ 22 mm chipboard facing.30 mm + 18/ 22 mm chipboard facing.35 mm + 18/ 22 mm chipboard facing.40 mm + 18/ 22 mm chipboard facing.50 mm + 18/ 22 mm chipboard facing.60 mm + 18/ 22 mm chipboard facing.65 mm + 18/ 22 mm chipboard facing.70 mm + 18/ 22 mm chipboard facing.75 mm + 18/ 22 mm chipboard facing.80 mm + 18/ 22 mm chipboard facing.90 mm + 18/ 22 mm chipboard facing.100 mm + 18/ 22 mm chipboard facing.120 mm + 18/ 22 mm chipboard facing.140 mm + 18/ 22 mm chipboard facing.160 mm + 18/ 22 mm chipboard facing. |
Facing | Chipboard. |
Edges | Tongued and grooved. |
Density | To BS EN 1602, 30 kg/m³ minimum. |
TemperatureRange | -50 to +75°C. |
Water vapour diffusion factor (to EN 12086) | 100 µ. |
Sustainability data
Contains Red List materials | No |
Country of product manufacture | United Kingdom |
Literature
Acoustics
Case studies
Ivydale Primary School, Southwark