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HEXATHERM® XCHiP - Thermal Chipboard Laminate Floorboard

Verified by manufacturer 5 months ago

Cellecta Ltd Third party certifications:
  • ISO 14001 Environmental Management Systems

    Certificate type

  • ISO 9001 Quality Management

    Certificate type

Extruded polystyrene thermal insulation board bonded to a chipboard facing.

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Application

Thermal insulation board, suitable for floors and walls.

Description

High performance extruded polystyrene with a facing board to produce a composite thermal board to suit a specific application.


Features and benefits:

  • 100% recyclable.
  • CFC and HCFC free.
  • Closed cell structure.
  • Code for Sustainable Homes Pol 1 compliant.
  • Composite board.
  • High compressive strength.
  • High thermal performance.
  • Wide range of thicknesses available: 20–160 mm.
  • Zero ODP & Less than 5 GWP.
  • Manufactured in accordance with BS EN 13374, and tested to BS EN 12267.
  • Long term water absorption by immersion (% volume, to BS EN 12087): <0.7%.


Grade (to BS EN 826): CS250.

General information

Color

Grey

Yellow

Finish

Smooth

Material

High density extruded polystyrene (XPS)

Guidance for specification option:

 (XPS) with an 18/ 22 mm thick chipboard facing

Chipboard

Shape

Rectangle

Length

2400 mm

Width

600 mm

Height

38 mm

43 mm

48 mm

58 mm

68 mm

Show more

Uniclass

Pr_25_71_63_29 Extruded polystyrene (XPS) boardsPrimary

CAWS

E20/200 Proprietary underslab insulation

E20/30 Underslab insulation

M10/290 Floating construction

M10/40 Floating construction

M11/220 Mastic asphalt floor underlay

Specification data - Extruded polystyrene (XPS) boards

Compressive strength (minimum) at 10% compression

To BS EN 826, 300 kPa.

Thermal conductivity (maximum)

To BS EN 12667, 0.033—0.034 W/mK.

Thickness

20 mm + 18/ 22 mm chipboard facing.

25 mm + 18/ 22 mm chipboard facing.

30 mm + 18/ 22 mm chipboard facing.

35 mm + 18/ 22 mm chipboard facing.

40 mm + 18/ 22 mm chipboard facing.

50 mm + 18/ 22 mm chipboard facing.

60 mm + 18/ 22 mm chipboard facing.

65 mm + 18/ 22 mm chipboard facing.

70 mm + 18/ 22 mm chipboard facing.

75 mm + 18/ 22 mm chipboard facing.

80 mm + 18/ 22 mm chipboard facing.

90 mm + 18/ 22 mm chipboard facing.

100 mm + 18/ 22 mm chipboard facing.

120 mm + 18/ 22 mm chipboard facing.

140 mm + 18/ 22 mm chipboard facing.

160 mm + 18/ 22 mm chipboard facing.

Facing

Chipboard.

Edges

Tongued and grooved.

Density

To BS EN 1602, 30 kg/m³ minimum.

TemperatureRange

-50 to +75°C.

Water vapour diffusion factor (to EN 12086)

100 µ.

Sustainability data

Contains Red List materials

No

Country of product manufacture

United Kingdom

Third party certifications

Third party certifications

ISO 14001 Environmental Management Systems

ISO 14001 Environmental Management Systems

ISO 14001 Certificate

ISO 9001 Quality Management

ISO 9001 Quality Management

ISO 9001 Certificate

Literature

Acoustics

Acoustics

Case studies

Ivydale Primary School, Southwark

Ivydale Primary School, Southwark

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