HEXATHERM® XCHiP
High performance extruded polystyrene thermal insulation board bonded to a chipboard facing.
High performance extruded polystyrene thermal insulation board bonded to a chipboard facing, suitable for floors and walls. It combines the benefits of high performance extruded polystyrene with a facing board to produce a composite thermal board to suit a specific application. Manufactured in accordance with BS EN 13374 and tested to BS EN 12267.
Features:
- 100% recyclable.
- CFC and HCFC free.
- Closed cell structure.
- Code for Sustainable Homes Pol 1 compliant.
- Composite board.
- High compressive strength.
- High thermal performance.
- Wide range of thicknesses available: 20–160 mm.
- Zero ODP & Less than 5 GWP.
Features | 100% recyclable CFC and HCFC free Closed cell structure Code for Sustainable Homes Pol 1 compliant Composite board |
Material | Extruded polystyrene (XPS) with an 18/ 22 mm thick chipboard facing |
Size | 600 x 2400 mm |
Uniclass 2015 | |
CAWS | E20/200 Proprietary underslab insulation E20/30 Underslab insulation M10/290 Floating construction M10/40 Floating construction M11/220 Mastic asphalt floor underlay |
Product Reference | HEXATHERM® XCHiP |
Thickness | 20 mm + 18/ 22 mm chipboard facing25 mm + 18/ 22 mm chipboard facing30 mm + 18/ 22 mm chipboard facing35 mm + 18/ 22 mm chipboard facing40 mm + 18/ 22 mm chipboard facing50 mm + 18/ 22 mm chipboard facing60 mm + 18/ 22 mm chipboard facing65 mm + 18/ 22 mm chipboard facing70 mm + 18/ 22 mm chipboard facing75 mm + 18/ 22 mm chipboard facing80 mm + 18/ 22 mm chipboard facing90 mm + 18/ 22 mm chipboard facing100 mm + 18/ 22 mm chipboard facing120 mm + 18/ 22 mm chipboard facing140 mm + 18/ 22 mm chipboard facing160 mm + 18/ 22 mm chipboard facing |
Standard product features | Material: Extruded polystyrene (XPS) with an 18/ 22 mm thick chipboard facing. Size: 600 x 2400 mm. Edges: Tongue and grooved. Grade (to BS EN 826): CS250. Technical properties:
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