HEXATHERM® XCHiP
Description

High performance extruded polystyrene thermal insulation board bonded to a chipboard facing, suitable for floors and walls. It combines the benefits of high performance extruded polystyrene with a facing board to produce a composite thermal board to suit a specific application. Manufactured in accordance with BS EN 13374 and tested to BS EN 12267.

Features:

  • 100% recyclable.
  • CFC and HCFC free.
  • Closed cell structure.
  • Code for Sustainable Homes Pol 1 compliant.
  • Composite board.
  • High compressive strength.
  • High thermal performance.
  • Wide range of thicknesses available: 20–160 mm.
  • Zero ODP & Less than 5 GWP.

General information

Features

100% recyclable

CFC and HCFC free

Closed cell structure

Code for Sustainable Homes Pol 1 compliant

Composite board

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Material

Extruded polystyrene (XPS) with an 18/ 22 mm thick chipboard facing

Size

600 x 2400 mm

Uniclass 2015

Pr_25_71_63_29 Extruded polystyrene (XPS) boardsPrimary

CAWS

E20/200 Proprietary underslab insulation

E20/30 Underslab insulation

M10/290 Floating construction

M10/40 Floating construction

M11/220 Mastic asphalt floor underlay

Specification data - Extruded polystyrene (XPS) boards

Product Reference

HEXATHERM® XCHiP

Thickness

20 mm + 18/ 22 mm chipboard facing

25 mm + 18/ 22 mm chipboard facing

30 mm + 18/ 22 mm chipboard facing

35 mm + 18/ 22 mm chipboard facing

40 mm + 18/ 22 mm chipboard facing

50 mm + 18/ 22 mm chipboard facing

60 mm + 18/ 22 mm chipboard facing

65 mm + 18/ 22 mm chipboard facing

70 mm + 18/ 22 mm chipboard facing

75 mm + 18/ 22 mm chipboard facing

80 mm + 18/ 22 mm chipboard facing

90 mm + 18/ 22 mm chipboard facing

100 mm + 18/ 22 mm chipboard facing

120 mm + 18/ 22 mm chipboard facing

140 mm + 18/ 22 mm chipboard facing

160 mm + 18/ 22 mm chipboard facing

Standard product features

Material:

Extruded polystyrene (XPS) with an 18/ 22 mm thick chipboard facing.

Size:

600 x 2400 mm.

Edges:

Tongue and grooved.

Grade (to BS EN 826):

CS250.

Technical properties:

  • Compressive strength (to BS EN 826): 280 kPa.
  • Density (minimum, to BS EN 1602): 30 kg/m³.
  • Long term water absorption by immersion (% volume, to BS EN 12087): <0.7%.
  • Temperature range: -50 to +75°C.
  • Thermal conductivity (to BS EN 12667): 0.035W/mK.
  • Water vapour diffusion factor (to BS EN 12086): 100 µ.

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