NBS Source
744 Thermal Floor Panel (Grade 1)


Mayplas Thermal Floor Panel is designed for use as a composite thermal insulation/ flooring panel on beam and block and concrete bases. It is suitable for new and refurbished buildings, conservatories and extensions.

Extruded polystyrene slab laminated to V313 tongue and grooved moisture resistant chipboard to form a composite flooring/ insulation panel.


  • Easy to cut and install.
  • One operation – saves time.
  • Ready for floor covering.
  • Excellent thermal insulation.

General information

Uniclass 2015

Pr_25_71_97_60 ParticleboardsPrimary


K11/30 Particleboard flooring

Product range

Floor Insulation

Specification data - Particleboards

Product Reference

744 Thermal Floor Panel (Grade 1)

Polystyrene thickness

25 mm

35 mm

50 mm

Standard product features

Chipboard thickness:

18 mm.

Panel size:

2400 x 600 mm.

Product Options


- Extruded polystyrene:

  • Density: 27 kg/m³.
  • Compressive strength: 220 kPa.
  • Thermal conductivity: 0.028 W/mK.
  • Water absorption: 0.2% by volume.

- Chipboard:

  • Moisture resistance: C4 V313 moisture resistant grade.
  • Thermal conductivity: 0.14 W/mK.

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741 Lamella Floor Panel

741 Lamella Floor Panel