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HPL Bonded Board - SIGNATURE (POLYPREY©)
HPL Bonded Board - SIGNATURE (POLYPREY©)

Verified 11 months ago

Polyrey UK

HPL Bonded Board - SIGNATURE Creation®

Verified 11 months ago

Polyrey UK

HPL Bonded Board - SIGNATURE Library®

Summary
High pressure laminate (HPL) bonded board covering, available in a bespoke range of graphic finishes in various colours, or custom designs.
High pressure laminate (HPL) bonded board covering, available in a bespoke range of graphic finishes in various colours, or custom designs.
Finish
Anti-microbial
Anti-microbial
Material
High pressure laminate (HPL)
High pressure laminate (HPL)
Length
3070 mm
3070 mm
Width
1240 mm
1240 mm

Additional properties

Grade
Fire retardant grade., Moisture resistant grade., Standard grade.
Fire retardant grade., Moisture resistant grade., Standard grade.
Substrate/ Core
Birch plywood., Brown core medium density fibreboard (MDF)., Chipboard.
Birch plywood., Brown core medium density fibreboard (MDF)., Chipboard.
Decorative surface
To both sides., To one side.
To both sides., To one side.
Surface treatment
Antibacterial Sanitized® grade.
Antibacterial Sanitized® grade.
Materials
High pressure laminate (HPL) bonded board with a choice of core.
High pressure laminate (HPL) bonded board with a choice of core.
Dimensions
3070 x 1240 mm.
3070 x 1240 mm.
Standard
Birch plywood: Manufactured to EN 636-2. Chipboard, moisture resistant: EN 312 Type P3. Chipboard, standard and fire retardant: EN 312 Type P2. MDF: Manufactured to EN 622-5.
Birch plywood: Manufactured to EN 636-2. Chipboard, moisture resistant: EN 312 Type P3. Chipboard, standard and fire retardant: EN 312 Type P2. MDF: Manufactured to EN 622-5.