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Description

A revolutionary patented suspended ground floor system, designed to provide outstanding thermal and structural performance. The insulation blocks sit on and between standard pre-stressed concrete floor beams and is finished with a structural concrete topping. Compared with traditional concrete infill blocks, incorporating TETRiS blocks into the design dramatically reduces the static load imposed on the concrete beams, thus reducing the overall quantity of beams required and increasing the span bridged. It has been awarded the highest possible code for sustainable homes construction rating of A+ = 3 Code credits (Element No. 820140051).

Features:

  • 100% recyclable.
  • Can achieve U-values as low as 0.11 W/m²K.
  • CFC and HCFC free.
  • High compressive strength.
  • High thermal performance.
  • Produces a floor with zero cold bridges.
  • Quicker and easier to install than traditional beam and block floor systems.

General information
Features

100% recyclable

Can achieve U-values as low as 0.11 W/m²K

CFC and HCFC free

High compressive strength

High thermal performance

Produces a floor with zero cold bridges

Quicker and easier to install than traditional beam and block floor systems

Material

Extruded polystyrene (XPS)

Uniclass 2015 Extruded polystyrene (XPS) boards (Pr_25_71_63_29)
Specification data
Product Reference

TETRiS®

Type

T300

300 mm width.

T600

600 mm width.

Thickness

90 mm

100 mm

120 mm

140 mm

160 mm

Rebate size

Insert requirement, available 30–50 mm to suit beam size.

Gap strip

Not required

TGS

Width available 53–600 mm.

Vertical edge strip

Not required

TVES

Standard product features

Material:

Extruded polystyrene (XPS).

Length:

2500 mm.

Thickness above block:

75 mm.

Edges:

Rebated.

Grade (to BS EN 826):

CS300.

Technical properties:

  • Compressive strength (to BS EN 826): 320 kPa.
  • Density (minimum, to BS EN 1602): 34 kg/m³.
  • Long term water absorption by immersion (% volume, to BS EN 12087): <0.7%.
  • Temperature range: -50 to +75°C.
  • Thermal conductivity (to BS EN 12667): 0.035 W/mK.
  • Water vapour diffusion factor (to BS EN 12086): 100–200 µ.