A two part, solvent free, low viscosity, epoxy resin primer and damp proof membrane.
A two part, solvent free, low viscosity, epoxy resin primer. It is used in conjunction with SikaBond® Wood Floor adhesives for moisture control, substrate consolidation and adhesion promotion.
J30/10 Cold-applied damp-proofing
J30/130 Cold-applied damp-proofing
K21/10 Wood laminate flooring
K21/110 Wood flooring
K21/115 Wood laminate flooring
M42/10 Wood flooring
M42/110 Wood block flooring
M42/120 Mosaic parquet panel flooring
Sika® Primer MB
Standard product features
Tensile bond strength: