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HPL Bonded Board - POLYPREY©

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High pressure laminate (HPL) bonded board covering.

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Application

Can be used in high traffic areas such as:

Train stations.

Airports.

Schools.

Hospitals.

Laboratories.

Retail stores.

Suitable for both horizontal (worktops) and vertical applications (wall panelling).

Provides the same performance as Polyrey HPL - consult manufacturer for details.

Description

High pressure laminate (HPL) bonded board covering.

Features and benefits:

Ready to use decorative panel.

Provides a high level of resistance to external stress (abrasion, impacts, stains, cracks, scratches, and heat up to 180°C). Also resistant to the damage caused by cigarette burns, chemical and household products.

Good colourfastness when placed under artificial light.

Minimal maintenance required - easy to clean.

Food safe (IANESCO approved).

Quick to install.

Silver ion-treated, antibacterial Sanitized® grade - consult manufacturer for details.

Available in a wide range of decors and designs (GRANIT finishes recommended for intensive horizontal use - consult manufacturer for details).

Suitable for high quality industrial gluing.

Low formaldehyde emissions (E1) and PEFC™ certified.

Conforms to EN 438.

Applications:

Can be used in high traffic areas such as:

Train stations.

Airports.

Schools.

Hospitals.

Laboratories.

Retail stores.

Suitable for both horizontal (worktops) and vertical applications (wall panelling).

Provides the same performance as Polyrey HPL - consult manufacturer for details.

General information

Size	3050 x 1240 mm 3050 x 1320 mm 3060 x 1230 mm 3070 x 1240 mm
Finish	Consult manufacturer's literature and insert requirements. Note not all finishes are available with all designs.
Material	High pressure laminate (HPL) bonded board with a choice of core
Uniclass 2015	Pr_25_71_97_22 Decorative laminated plastics sheet veneered panelsPrimary
CAWS	K13/160 Proprietary

Specification data - Decorative laminated plastics sheet veneered panels

Product Reference	HPL Bonded Board - POLYPREY©
Grade	Fire retardant grade On request. Chipboard core only. Moisture resistant grade On request. Chipboard core only. Standard grade
Substrate/ Core	Birch plywood For use in humid interior environments. Brown core medium density fibreboard (MDF) Chipboard
Size	3050 x 1240 mm 3050 x 1320 mm 3060 x 1230 mm 3070 x 1240 mm
Design	Consult manufacturer's literature for details and insert requirements.
Finish	Consult manufacturer's literature and insert requirements. Note not all finishes are available with all designs.
Decorative surface	To both sides To one side

Standard product features

Material:

High pressure laminate (HPL) bonded board with a choice of core.

Thickness:

19.6–20 mm (dependent on finish specified).

Classification:

Birch plywood: Manufactured to EN 636-2.

Chipboard, moisture resistant: EN 312 Type P3.

Chipboard, standard and fire retardant: EN 312 Type P2.

MDF: Manufactured to EN 622-5.

Technical characteristics:

Density (to EN 323): Chipboard, standard: 650 kg/m³; chipboard, fire retardant: 700 kg/m³; chipboard, moisture resistant: 670 kg/m³; MDF: 760 kg/m³; birch plywood: 720 kg/m³.

Moisture content (to EN 322): Chipboard: 5–13%; MDF: 4–11%; birch plywood: 8–12%.

Straightness tolerance (to ISO 13894-1-6.2): ±0.5 mm/m.

Squareness tolerance (to ISO 13894-1-6.3): ≤2 mm/m.

Flatness tolerance (to EN 14323): ≤2 mm/m.

Impact resistance (small diameter ball, to EN 438-2-20): ≥15 N.

Impact resistance (324 g ball, to EN 438-2-21): ≥600 mm.

Glue quality (to ISO 13894-1-8): Level 5.

Surface cohesion (to ISO 13894-1-9): ≥1.0 MPa.

Screw retention (to ISO 13894-1-15): Dependent on finish specified.

Modulus of elasticity (to ISO 16978, 18 mm substrate): Breaking point: Chipboard and MDF: ≥35 MPa; birch plywood: ≥60 MPa; Modulus of elasticity: Chipboard and MDF: ≥4500 MPa; birch plywood: ≥6000 MPa.

Water resistance (maximum edge swelling, to ISO 13894-1-19): Standard/ fire retardant chipboard and MDF: 15%; moisture resistant chipboard and birch plywood: 5%.