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Beneath Heat 15 mm Slim Board Over Floor UFH System - Underfloor Heating System
Valmistajan varmentama yli vuosi sitten
Underfloor heating (UFH) system for use over the floor, pipes held in place by low-profile cement-reinforced XPS grooved insulation boards.
Käyttötarkoitus
Underfloor heating (UFH) system for use over the floor, in new builds and renovation.
Kuvaus
Underfloor heating (UFH) system for use over the floor, pipes held in place by low-profile cement-reinforced XPS grooved insulation boards.
Features and benefits:
- Lightweight XPS insulation panel with webbed polymer cement-based finish.
- Fixed down with either flexible tile adhesive or screwed down using a minimum of nine screws & nine washers per board.
- Low profile, 15 mm total height.
- Either a tile or an interlocking wood floor finish can be applied directly over the board. Other floor finishes will require a minimum of 3 mm self-levelling compound to be applied on top of the slim board.
- Quick and easy to install.
- For use with 10 mm-diameter PERT pipes at 150 mm centres.
- Heating performance*: 71 W/m².
*Heat output at a flow water temperature of 45°, based on a tog rating of 1 with a room temperature of 21°. Consult manufacturer's literature for full details.
Yleistiedot
Väri | |
Viimeistely | Grooved Ohjeistus valinnaisen ominaisuuden määrittelyyn: Webbed polymer cement-based (board only). |
Materiaali | High density extruded polystyrene (XPS) Ohjeistus valinnaisen ominaisuuden määrittelyyn: P5 grade. |
Muoto | Rectangle |
Pituus | 1200 mm |
Leveys | 600 mm |
Korkeus | 15 mm |
Takuun kuvaus | Two year Valmistajan ohjeistusConsult manufacturer for full details. |
Uniclass | |
CAWS | T90/475 Underfloor heating systems T90/475 Underfloor heating systems |
SKU Code | 15MMSLIM |
Erittelytiedot - Underfloor low-temperature hot water heating systems
Luokittelutiedot | |
System performance | Ohje vaihtoehtoiseen määritykseen: Insert requirements. |
Heat source | Low-temperature hot water heating system. Ohje vaihtoehtoiseen määritykseen: Specify details separately. |
Pumps | Beneath Heat underfloor heating pump pack. Beneath Heat single area pump pack. Valmistajan ohjeistusConsult manufacturer for details. |
Pipework | |
Distribution | Ohje vaihtoehtoiseen määritykseen: Insert requirements. |
Underfloor | 10 mm PERT pipes and fittings. Valmistajan ohjeistusInstallation tools available, including pipe decoilers, pipe cutters and pipe calibrators. |
Jointing materials | Ohje vaihtoehtoiseen määritykseen: Insert requirements. |
Insulation | 15 mm slim XPS board with webbed polymer-cement-based finish. Ohje vaihtoehtoiseen määritykseen: Consult manufacturer's literature for installation details. Valmistajan ohjeistusConsult manufacturer for details. |
Pipe supports | As Pipework: Insulation; 150 mm centres. |
Valves | Ohje vaihtoehtoiseen määritykseen: Consult manufacturer for options and insert requirements. Options include manifolds, blend valves, heat pump valves and return elbows. |
Water treatment | Ohje vaihtoehtoiseen määritykseen: Consult manufacturer for options and insert requirements or omit. |
Accessories | 230 V Saswell dial thermostat. Ohje vaihtoehtoiseen määritykseen: Consult manufacturer for options and insert requirements. 230 V Saswell programable thermostat. 230 V Saswell WiFi thermostat. Wireless Saswell programable thermostat. Wireless Saswell WiFi thermostat. Saswell WiFi gateway |
Controls | |
Controllers | Saswell 230 V two wire actuator. 230 V wiring centre. 230 V wireless wiring centre. |
Control valves | Saswell two-port motorised valve. |
Sensors | Not required. Saswell floor/ air sensor. Single area pump pack adaptors. Ohje vaihtoehtoiseen määritykseen: Not for use with single area pump pack. |
Floor covering | Tiled. Ohje vaihtoehtoiseen määritykseen: Can be applied directly over the slim board. Specify separately if required. Interlocking wood flooring. Ohje vaihtoehtoiseen määritykseen: Can be applied directly over the slim board. Specify separately if required. Other Ohje vaihtoehtoiseen määritykseen: Minimum 3 mm self-levelling compound required before final covering is applied. Specify separately if required. |
Kestävyystiedot
Sisältää Red List -materiaaleja | No |
Materiaalin alkuperämaa | China |
Tuotteen valmistusmaa | China |
Kierrätettävyys | None |
Kierrätetty sisältö | 0 % |
Dokumentit
Dokumenttityyppi
Underfloor Heating Product and Technical Guide
Beneath Plate 15 mm Slim Board Over Floor UFH System
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