Verified by manufacturer 23 days ago
EPD
Certificate type
Thin bonded flooring system designed to level and smooth prepared substrates prior to the installation of floor coverings, suitable for dry substrates and floors requiring integrated moisture control.
The weberfloor thin bonded system is intended for internal bonded floor constructions and must be applied to sound, suitably prepared substrates. Substrates requiring repair should be assessed and made good using an appropriate repair system prior to installation. The substrate must achieve a minimum pull‑off strength of ≥ 1.0 MPa to ensure adequate bond performance.
When specifying the system, consideration should be given to the requirements of the final floor covering and the measured substrate moisture condition to determine whether a moisture control solution is required as part of the overall floor build‑up. The system is not suitable for external applications.
The weberfloor thin bonded system is a low‑profile cementitious flooring preparation system designed to level and smooth prepared substrates prior to the installation of final floor finishes.
The system supports use on dry substrates or on floors with elevated residual moisture where appropriate moisture control is incorporated, and is suitable for thin section applications within a bonded floor construction, typically in the range of 3–30 mm.
Designed to support efficient installation programmes, the system maintains compatibility with common floor covering types. Project‑specific detailing and alternative build‑ups are available where site conditions differ from those assumed within the standard system.
Color | Grey |
Finish | Smooth |
Material | Cementitious |
Shape | Formless |
Length | Bespoke |
Width | Bespoke |
Height | Bespoke |
Warranty description | Ten year |
Uniclass | |
CAWS | M50/15 Carpet tiling M50/130 Carpet tiling M40/110 Tiling M40/5 Tiling M41/110 Terrazzo tiling M41/110 Terrazzo tiling K21/146 Laminate flooring K21/145 Composite laminate flooring K21/10 Wood laminate flooring K21/115 Wood laminate flooring M10/3 Bonded cement:sand levelling screeds M10/110 Bonded cement:sand levelling screeds |
Product range |
Classification data | |
System performance | Guidance for specification option: The weberfloor thin bonded system is designed for the preparation, smoothing and levelling of prepared substrates in readiness for the installation of floor coverings. When installed as a complete system, the screed provides high compressive and flexural strength and is capable of achieving surface regularity classes up to SR1 in accordance with BS 8204, subject to correct substrate preparation and application practice. System performance characteristics including mechanical strength development, drying behaviour, moisture tolerance, bond performance and compatibility with floor finishes are based on the combined use of weberfloor 4150, weberfloor DPM Pro and weberfloor 4716 primer, applied in the defined sequence and in accordance with manufacturer guidance. Where individual system components are omitted, substituted or altered, declared system performance should not be assumed without technical confirmation. |
Preparation | Preparation of substrate for fully bonded construction. Guidance for specification option: Prepare the base to provide a clean, sound, dry and suitably even substrate for thin bonded installation. Where necessary, carry out mechanical surface preparation to remove laitance, contamination and weak surface material. Ensure the substrate is structurally sound, dust-free and capable of achieving a minimum tensile pull-off strength of 1.0 N/mm² when tested in accordance with relevant standards. Assess the substrate for moisture condition, flatness, cracking and general suitability prior to installation. Repair cracks, voids or localised defects using appropriate repair materials, and carry out all preparation works under suitable environmental conditions in accordance with manufacturer guidance before application of the flooring system. |
Movement joints | |
Components | Guidance for specification option: Movement joints or joints designed to accommodate movement shall be provided as part of the structural or flooring design and are not supplied as part of the weberfloor thin bonded system. |
Bedding | Guidance for specification option: Do not fill, bridge or otherwise obstruct movement joints or joints designed to accommodate movement with preparation, levelling or smoothing products. Ensure movement capability is maintained through the flooring construction in accordance with the design intent of the joint. |
Screed | weberfloor smooth 4150 smoothing and levelling compound. Guidance for specification option: Quick drying self-smoothing thin topping screed - for final floor covering in as little as three days. |
Surface treatment | No surface treatment is required as part of the weberfloor thin bonded system. Guidance for specification option: The system is designed to enable the direct application of floor coverings once the levelling screed has achieved the required condition. The screed is not intended to act as a wearing surface, and no curing compounds, sealers or protective surface treatments are included or required. |
System completion | Guidance for specification option: The weberfloor thin bonded system is considered complete once the levelling screed has been installed in accordance with the specification and manufacturer guidance, and has achieved a condition suitable to receive the specified floor covering. Prior to application of floor finishes, ensure the surface is clean and free from contamination that may adversely affect adhesion. Final acceptance of surface condition and readiness for floor covering installation shall be in accordance with the requirements of the floor finish manufacturer. |
Surface regularity | To BS 8204, SR1. |
Primer | weberfloor 4716. Guidance for specification option: Styrene acrylate primer:
Not required. Manufacturer guidance
|
Moisture control layer | weberfloor DPM Pro. Guidance for specification option: Moisture control is provided using weberfloor DPM Pro where required to manage residual moisture within the substrate prior to installation of the levelling screed system. Assess substrate moisture conditions prior to installation in accordance with relevant British Standards and industry guidance. Incorporate moisture control measures as required to ensure compatibility with the flooring system and subsequent floor coverings. Not required. |
Drying time | Allow all system components to dry, cure or condition sufficiently between stages in accordance with manufacturer guidance and site conditions. Guidance for specification option: Weberfloor DPM Pro and weberfloor 4716 primer shall be allowed to reach a condition suitable for overcoating prior to application of subsequent system components. The levelling screed shall be permitted to dry sufficiently before the application of floor coverings. Drying times are dependent on thickness, environmental conditions and site circumstances, and shall be confirmed in accordance with manufacturer guidance. |
Floor covering | Guidance for specification option: Insert further details as required. The weberfloor thin bonded system is designed to receive floor coverings and does not include the supply or installation of the finished floor covering. The prepared surface is suitable for the direct application of common floor covering types, subject to the requirements and installation guidance of the floor covering manufacturer. |
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Contains Red List materials | No |
Country of material origin | Europe |
Country of product manufacture | United Kingdom |
Manufacturing plant location | |
Material | Cementitious |
Recycled contentAs defined in clause 7.8 of BS EN ISO 14021 | 8 % |
Expected Life | 60 year |
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ISO 14001:2015 Environmental Management System
ISO 45001:2018 Occupational Health & Safety Management System
ISO 9001:2015 Quality Management System